Power gating structure having data retention and intermediate modes

ABSTRACT

The present invention provides a power gating structure having data retention and intermediate modes and able to operate under multiple modes. A conventional power gating structure has only turn-on and turn-off functions, and is used to suppress a leakage current problem which has become more and more serious in advance manufacture processes, under a turn-off mode. However, in a memory circuit, such as latch, register and SRAM, when the power gate is turned off, a new power gating structure is required for data retention. The power gating structure of the present invention can be set into one of 4 different operational modes: a data retention mode for maintaining the static noise margin of the memory, an intermediate mode for reducing the interference on ground and power levels, an active mode used when the circuit operates in normal condition, and a standby mode used when the circuit does not operate.

BACKGROUND OF THE INVENITON

1. Field of the Invention

The present invention relates to a new power-gating structure, and inparticular to a power-gating structure in which the data stored involatile memories can be maintained when the system is in a standbymode, and a ground or power supply bounce caused at the switching of apower-gating device can be reduced.

2. Description of the Related Art

As shown in FIG. 1, prior power gating (control) devices can beclassified into two, i.e. a footer device and a header device. Thefooter device is to interpose NMOS sleep transistors between a realground and a virtual ground; and the header device is to interpose PMOSsleep transistors between a real voltage source (real VDD) and a virtualvoltage source (virtual VDD). Moreover, an individual internal circuitcan be a combination circuit or a sequential circuit; and the powergating device can receive a sleep signal from a power management unitwhich determines a current-adopted system power saving scenario.Although the prior power gating control method is practical for thecombination circuit, the power gating devices can damage the staticnoise margin (SNM) of storage elements in the sequential circuit.

FIG. 2 shows a SRAM array having the power gating device. It can beobviously seen from Table 1 that SNM is 0 mV when the power gatingdevice is turned off. It means that the data stored in the SRAM can notbe guaranteed to be correct. However, during a standby mode, a 24×leakage current reduction can be achieved by using the prior powergating device.

Many publications propose a resolving scheme by using an MTCMOS as apower gate device. However, in an active mode, a transistor with a muchhigher threshold voltage used as a power gating device requires a largersilicon area to make the power gating device absorb a maximum instantcurrent. Therefore, it is desired to use a single threshold voltagetransistor as a power gating device or to adjust adaptively the wellbias of the power gating device for reducing the area occupied by thepower gating device.

For example, U.S. Pat. No. 6,552,601, entitled “Method for Supply GatingLow Power Electronic Device” and US Patent Application No. 2003/197544,entitled “Method and Structure for Supply Gated Electronic Components”disclose a power gating device. However, it belongs to a combination ofFooter/Header in structure, and still can not be used in memorycircuits.

In summary to the above, the prior power gating device has the followingdisadvantages: 1. a problem of maintaining data retention 2. A problemof reducing ground/power supply bounces caused during switching.

SUMMARY OF THE INVENTION

A primary objective of the present invention is to resolve the problemsmentioned above in the conventional power gating structure, and topropose a data retention and intermediate modes combined power gatingstructure has concurrent data retention and intermediate modes, whereinthe data retention and intermediate modes combined power gate is toarrange one or more NMOS/PMOS transistors between a virtual ground and areal ground or a virtual voltage source and a real voltage source, andone or more gate terminal(s) of the regular power gating device and/orthe data retention power gating device can be controlled by a powermanagement unit, so that the power gating device can have 4 operationalmodes: a data retention mode, an intermediate mode, an active mode and astandby mode. The main difference between the present invention and theabove-mentioned patents is that an additional data retention function isincluded. This function is very important in memory circuits. And,through FIGS. 5, 6, 7 and 10, the main difference between the presentinvention and the above-mentioned patents can be seen clearly. Moreover,the present invention has 4 different operational modes and is quitedifferent from the above-mentioned patents that only have twooperational modes (turned-on and turned-off modes). Furthermore, theadditional data retention mode and intermediate mode of the presentinvention play important roles in the power management of asystem-on-a-chip.

Namely, when the prior power gating structure is in a standby mode-thatis to say, when the power gating device is turned off, the data storedin an integrated circuit will be lost. Therefore, the conventional powergating structure is not suitable for volatile memory circuits, such aslatch/register file/SRAM. Another conventional power gating device hasthe following problem: a ground bounce is induced at the switching ofthe power gating device, and if the power gating device is applied witha voltage source (VDD), a power supply bounce is encountered.

Furthermore, since the power gating structure of the present inventionhas data retention and intermediate modes, a secondary objective of thepresent invention is to resolve: 1. a problem of suppressing leakagecurrent of the system-on-a-chip; 2. a problem of power management of thesystem-on-a-chip; 3. a problem of data loss in the volatile memoriesduring the stand by mode; and 4. a problem of ground/power supplybounces caused at the switching of the power gating device.

The data retention and intermediate modes combined power gatingstructure proposed by the present invention can be set into one of 4different operational modes: a data retention mode used for maintainingthe static noise margin (SNM) of a memory an intermediate mode used forreducing the interference of power level an active mode used for normaloperation in the circuit and a standby mode used when the circuit is notin operation.

Moreover, the power management of the system-on-a-chip needs to dealwith the unprecedented increase in power density and leakage current. Inall to-be-selected items, a voltage island having a power managementunit is much more attractive in active or passive power reduction.

Furthermore, all active powers in the chip are reduced due tomulti-supply voltages adopted. A block having tight timing constraintsin calculation density is designated to a high supply voltage so as tomaintain the efficiency of the entire system. Meanwhile, as long astiming is satisfactory, other blocks can be designated to a lower supplyvoltage so as to reduce active power consumption.

Due to the separation of voltage domains, circuits operating in the samevoltage domains share the same properties, such as entering idle mode orcurrent calculated data. Therefore, circuits in the same voltage islandcan be attached in the same set of power gating device, and can turn onor turn off all blocks at the same time.

Because of the progress in CMOS technology and the general requirementof mobile information devices, a standby power reduction has become animportant topic. Leakage current has become more serious in MOStransistors, and especially, sub-threshold and gate leakage currents innano scale CMOS technology. After a power gating device is interposedbetween a virtual ground and an external real ground, the sub-thresholdleakage current can be efficiently reduced, wherein the ground of thecircuit in the chip is connected to the virtual ground. During theoperation in an active mode, the power gating device serves as a mirrorpower rail impedance, which does not affect correctness in function.When a standby mode signal is asserted, the powder gating device acts asan open switch to disconnect the direct connection between the powersupply and an internal circuit. This technology is quite useful toreduce the standby power, and can extend the lifetime of a battery for amobile information device that at most of time stays in a standby mode.

In conclusion, the present invention has the following advantages: 1.The data stored in a volatile memory can be continuously maintainedafter the power switch is turned off to make the system enter a standbymode; 2. Ground/power supply bounces caused at the switching of thepower switch are reduced; 3. 4 different operational modes are providedto reduce the complexity of the power management in thesystem-on-a-chip; 4. A new power gating structure can be provided tokeep the ability of a conventional power gate in suppressing the leakagecurrent of advanced process formed circuits. 5. The leakage current ofthe system-on-a-chip can be reduced without an additional manufactureprocess.

BRIEF DESCRIPTION OF THE DRAWINGS

Referring to the accompanying drawings, the features and inventivenessof the present invention will become much more obvious. In the drawings:

FIG. 1 (a) shows a prior NMOS footer array power gating device;

FIG. 1 (b) shows a prior PMOS footer array power gating device;

FIG. 2 shows a SRM array having a power gating device for reducingstandby power consumption;

FIG. 3 (a) is a graph showing the definition of static noise margin(SNM);

FIG. 3 (b) shows a SNM measuring step;

FIG. 4 shows a typical SNM simulation result, wherein X axis is theamplitude of the static noise, and the cross point of 4 curves is apoint where the states of data are flipped due to static noises;

FIG. 5 shows a data retention power gating device having a regular powergating device for maintaining the static noise margin of storageelements in a standby mode;

FIG. 6 (a) shows an NMOS transistor of which the gate is applied with aspecific voltage (a source voltage (VDD) in this example);

FIG. 6 (b) shows an NMOS transistor of which the gate is connected tothe drain to form a voltage control resistor;

FIG. 6 (c) shows an PMOS transistor of which the gate is connected to areal ground to form a voltage control resistor;

FIG. 7 are views showing modified data retention power gating devices inwhich the reciprocal SNM of NMOS or PMOS transistors are stacked formuch lower leakage current;

FIG. 8 shows the simulation result of the data retention power gatingdevice—leakage current versus size of the data retention power gatingdevice;

FIG. 9 shows the simulation result of the data retention power gatingdevice—SNM versus size of the data retention power gating device;

FIG. 10 shows a concurrent data retention and intermediate modes powergating structure;

Table 1 shows the comparison between static noise margin and powerconsumption for many different types of power gating devices; and

Table 2 shows control signals in different operational modes.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to accompanying drawings, the features and inventiveness ofthe present invention are quite obvious. Cell stability determinessoft-error and the sensitivity of a memory so as to deal with tolerancesand operational conditions. FIG. 3(a) is a graph showing a static noisemargin (SNM); FIG. 3(b) shows a step of measuring the static noisemargin; and FIG. 4 shows a typical static noise margin simulationresult. We can know from FIG. 4 that with the increase of the staticnoises, the data stored in the memory will gradually flip their states.After interposing all types of power gating device, we will use thismethod to test all static noise margins.

We appreciate from the above that the prior power gating device canoperate normally in the combination circuit. However, during a standbymode, storage elements require a power gating device (named as a dataretention power gating device) to maintain the static noise margin. Thisstructure is shown in FIG. 5, wherein the data retention power gatingdevice is a general power gating device which is interposed in parallel.A set of power gating devices is shown in FIG. 6.

FIG. 6(a) shows a small type of NMOS transistor. The data retentionpower gating device is never turned off, and the gate of the NMOStransistor is applied with a specific voltage bias. Since this currentconnects a virtual ground and a real ground, the static noise margin cannot be seen in any power gating devices. However, leakage currentreduced by the data retention power gating device is very small.

FIG. 6(b) shows an NMOS transistor of which the gate and the drain areconnected to each other to form a voltage control resistor. Meanwhile,during the operation in an active mode, the virtual ground isapproximate to an equi-potential. After the regular power gating deviceis turned off, the virtual ground becomes floating, and the leakagecurrent starts to charge the virtual ground. At the beginning, the dataretention power gating device acts as a high-impedance resistor. Withthe increase on the potential of the virtual ground, the equivalentimpedance between the virtual ground and the real ground become muchsmaller, so that the potential of the virtual ground can be preventedfrom being further increased. Finally, the potential become balanced andstable. Due to the reduced potential difference between the sourcevoltage (VDD) and the virtual ground, the static noise margin isdeclined, but it still falls within an acceptable range. The leakagecurrent is reduced, but it is smaller than that reduced by a singleconventional power gating device. As shown in Table 1, the second typeof NMOS resistor data retention power gating device can reduce theoriginal leakage current into half. The third type of PMOS resistor dataretention power gating device shown in FIG. 6(c) is a counterpart to thesecond type of NMOS. If the second type of NMOS resistor and the thirdtype of PMOS resistor have the same size, the third type of device showsa better inhibition ability for the leakage current because of higherequivalent impedance. The enhanced second and third type of dataretention power gating structures for suppressing the leakage currentare shown in FIG. 7 (a) and FIG. 7 (b). Since the static noise marginand the leakage current all have a direct relation to the equivalentresistance of the data retention power gate, the present invention alsoprovides an enhanced data retention power gate in which NMOS/PMOStransistors are cascaded between the a virtual ground and a real ground(or a virtual source voltage and a real source voltage), and one or moregates of the NMOS transistors is/are connected to the virtual ground andthe gates of the PMOS transistors are connected to a power managementunit so as to obtain a high equivalent impedance and thus to control theamount of the leakage current. The most basic way is that the NMOS/PMOStransistors are cascaded or stacked to obtain a high equivalentimpedance. Therefore, the static noise margin can be disregarded forobtaining a lower leakage current, or a larger leakage current isallowed to greatly increase the static noise margin. The simulationresult of the third type of data retention power gating device is shownin FIG. 8 and FIG. 9. These two graphs clearly show that the amount ofthe leakage current and the static noise margin are all directlyproportional to the size of the data retention power gating device, andcan be considered as a reciprocal equivalent impedance.

In the above description, we introduce and show the use of the voltagecontrol resistor that acts as the data retention power device anddisplay the voltage control resistor's influence on the static noisemargin and the reduced leakage current. Next, the concurrent cut-off anddata retention power gating structure will be more deeply introduced.

Cut-Off and Data Retention Combined Power Gating Structure

From the above description for performance of the data retention powergating device, we realize that the inhibition ability for the leakagecurrent relies on the difference in the order between the regular powergating device and the data retention power gating device. Therefore,once the data retention power gating device is interposed between thevirtual ground and the real ground, the leakage current can not beacceptable in certain circumstance. Thus, the present invention modifiesthe third type of data retention power gating device, and has a powermanagement unit for controlling the gates of the data retention powergating device (and regular power gating device). The detailed connectionof this concurrent cut-off and data retention power gating structure isshown in FIG. 10, wherein the data retention and intermediate modespower gate is constructed by arranging one or more NMOS/PMOS transistorsin parallel between a virtual ground and a real ground (or a virtualsource voltage and a real source voltage), and one or more gate(s) ofthe regular power gating device and/or the data retention power gatingdevice can be controlled by the power management unit, so that the dataretention and intermediate modes power gating structure have 4operational modes: a data retention mode, an intermediate mode, anactive mode and a standby mode, and the operation thereof is describedin detail as follows:

I. Active Mode: In FIG. 10, a Ctrl 1 signal is high, and a Ctrl 2 signalis low. Therefore, the regular power gating device and data retentionpower gating device both can support the full-speed operation of aninternal circuit.

II. Standby/Cut Off Mode: In FIG. 10, the Ctrl 1 signal is low, and theCtrl 2 signal is high. Since both of the regular power gating device anddata retention power gating device are turned off, a 20× leakage currentreduction can be achieved in this configuration. Although the datastored in storage elements will be damaged, it is allowed to damage thedata in this operational mode.

III. Data Retention Mode: In FIG. 10, the Ctrl 1 signal is low, and theCtrl 2 signal is low. In his operational mode, the regular power gatingdevice, not the one for data retention, is turned off. Therefore, duringthe standby mode, the data stored in the storage elements can bemaintained. However, the reduced amount of the leakage current is notlarger than that in the cut off mode.

IV. Intermediate Mode: In FIG. 10, the Ctrl 1 signal is high, and theCtrl 2 signal is also high. Namely, it is the intermediate mode duringtransitions of the foregoing three modes. In a mode transition, a groundbounce is undesired. Therefore, the intermediate mode is used to reducethe ground bounce. In Table 2, the summary in different mode operationsand their individual control states are obviously shown.

Although the invention has been described in terms of the preferredembodiment, various performances and modifications can be made withoutdeparture from the spirit and scope of the present invention which isdetermined by the claims below. TABLE 1 Type1: Type2: Type3: GatingStyle No Conv. Small NMOS N-resistor P-resistor SNM (mV) 340 ˜0 308 195163 Stand-by 561 22 558 28 22 Power (nW)

TABLE 2 Mode Ctrl1 Ctrl2 Active High Low Data-retention Low LowIntermediate High High Standby/Cut-off Low High

DESCRIPTION OF MAIN ELEMENTS AND THE CORRESPONDING REFERENCE NUMERALS

-   VDD Source Voltage-   GND Ground-   PMOS P-type Metal Oxide Semiconductor-   NMOS N-type Metal Oxide Semiconductor-   Ctrl 1 Control Signal 1-   Ctrl 2 Control Signal 2-   SNM Static Noise Margin

1. A data retention and intermediate modes combined power gatingstructure, having a concurrent data retention and intermediate modespower gating structure, wherein the data retention and intermediatemodes combined power gate is constructed by arranging one or moreNMOS/PMOS transistors in parallel between a virtual ground and a realground or a virtual source voltage and a real source voltage, and one ormore gate(s) of the regular power gating device and/or the dataretention power gating device is controlled by a power management unit,so that the data retention and intermediate modes combined power gatingstructure have 4 operational modes: a data retention mode, anintermediate mode, an active mode and a standby mode.
 2. The powergating structure as claimed in claim 1, wherein the data retention modeis when the power gate is set into the data retention mode, the datastored in a memory are maintained under the standby state.
 3. The powergating structure as claimed in claim 1, wherein the intermediate mode isa transition mode between the active mode and the standby mode for thepurpose of reducing interference on the ground or power level during themode transition, that is, reducing ground or power supply bounce.
 4. Thepower gating structure as claimed in claim 1, wherein the active mode isa mode in which a circuit normally operates.
 5. The power gatingstructure as claimed in claim 1, wherein the standby mode is a lowestleak current mode for the purpose of reducing the leakage current in asystem-on-a-chip as best as possible when a circuit does not operate. 6.The power gating structure as claimed in claim 1, wherein the power gateis a data retention power gating device having the regular power gatingdevice for maintaining the static noise margin of storage elements inthe standby mode.
 7. The power gating structure as claimed in claim 6,wherein the data retention power gate is composed of three differentelements, that is, has a first type, a second type and a third type. 8.The power gating structure as claimed in claim 7, wherein the first typeof data retention power gate is constructed by a smaller NMOStransistor, the gate voltage of the NMOS transistor is controlled todetermine the equivalent resistance of the NMOS transistor, and the gateis not only biased with a source voltage (VDD), but also can be biasedwith other appropriate voltage values.
 9. The power gating structure asclaimed in claim 7, wherein the second type of data retention power gateis an NMOS transistor of which the gate and the drain are connected toeach other to form a voltage control resistor so as to attain a dataretention function.
 10. The power gating structure as claimed in claim7, wherein the third type of data retention power gate is an MPOStransistor of which the gate and the drain are connected to each otherto form a voltage control resistor so as to attain a data retentionfunction.
 11. The power gating structure as claimed in claim 7, whereinthe data retention power gate is a single transistor or multipleseparated transistors.
 12. The power gating structure as claimed inclaim 1, wherein since the static noise margin and the leakage currentboth have a direct relation to the equivalent resistance of the dataretention power gate, the data retention power gate further includes anenhanced data retention power gate in which NMOS/PMOS transistors arecascaded between a virtual ground and a real ground (or a virtual sourcevoltage and a real source voltage), and one or more gates of the NMOStransistors is/are connected to the virtual ground and the gates of thePMOS transistors are connected to the power management unit so as toobtain a high equivalent impedance and thus to control the amount of theleakage current.
 13. The power gating structure as claimed in claim 11,wherein the enhanced data retention power gate is to cascaded NMOS orPMOS transistors so as to attain the maximum equivalent resistance. 14.The power gating structure as claimed in claim 1, wherein the powermanagement unit can be any signal sources.